PRODUCTS & SERVICES

View All Products & Services

THANK YOU FOR YOUR INQUIRY. OUR TEAM WILL BE CONTACTING YOU SHORTLY.

Request Product Info
Filter Results By:
Filter Results By
Product Categories
Product Families
Applications
Industries
Clear All Filters
Sort By:

Thick Film Conductor Materials for HTCC Applications

Ferro offers thick-film platinum and tungsten conductors designed to be co-fired with refractory zirconia tapes and alumina tapes. These refractory ceramic tapes and conductor pastes are co-fired at high peak temperatures over 1,400⁰ C.

Thick Film Conductor Materials for HTCC Applications

Our platinum and tungsten conductors, surface, buried and via-fills are specifically formulated for compatibility with refractory zirconia and alumina ceramic tapes.

Ferro’s thick film conductor materials are manufactured to be lead-free, cadmium-free and phthalate-free. All our thick film conductor materials for HTCC applications are formulated to be RoHs and REACH compliant.


FERRO THICK FILM CONDUCTOR MATERIALS FOR HTCC APPLICATIONS

THICK FILM CONDUCTORS and MATERIALS  DESCRIPTION  TYPICAL APPLICATIONS
5570 Platinum Conductive Paste Porous platinum thick film conductor paste designed to be co-fired with partially stabilized zirconia tape at high temperatures Applications include as electrodes in planar sensors
5571 Platinum Conductive Paste Designed to be co-fired with alumina tape at high temperatures Applications include as heaters in planar sensors
5574 Platinum Conductive Paste Designed to be co-fired with alumina tape at high temperatures Applications include leads or contact pads in planar sensors
5574-A Platinum Co-Firing Conductive Paste Designed to be co-fired with alumina tape at high temperatures. 5574-A is a slightly lower resistivity version of 5574 Applications include leads or contact pads in planar sensors
5575 Platinum Conductive Via Fill  Designed to be co-fired with alumina tape or partially stabilized zirconia at high temperatures Applications include as via fill in planar sensors
5575-C Platinum Co-Firing Conductive Via Fill Designed for use on refractory ceramic green tapes for use as a buried layer conductor; contains glass/ceramic binder Applications include as via fill in planar sensors


ELECTRONIC MATERIALS VALUE ADDED SERVICES
VALUE ADDED SERVICES
Ferro has over 20 years of experience in designing and manufacturing thick film materials and products formulated specifically for high temperature co-fired ceramics (HTCC) applications. 

Successful processing and firing of multilayer co-fired structures utilized in various sensors requires knowledge of dimensional stability during layer build and printing, shrinkage during firing, and the necessary firing regime to ensure that flat, blister-free parts are produced.  Our customers can leverage our prototype-building equipment and expertise in these processing aspects.  

We also provide training at our own facilities or on-site at our customers’ locations, with comprehensive programs that cover most aspects of sensor manufacturing including materials, equipment, prototype building, testing and evaluation processes.