IMAPS 2018
51st International Symposium on Microelectronics
Pasadena, CA, USA
THANK YOU FOR YOUR INQUIRY. OUR TEAM WILL BE CONTACTING YOU SHORTLY.
FERRO TO SHOWCASE EXPANDED PORTFOLIO AT IMAPS 2018
Ferro’s Electronic Materials group invites you to join us at IMAPS 2018, October 8-11, at the Pasadena Convention Center.
In booth #404, we will present our expanded portfolio, such as increased tape production capabilities, including LTCC and HTCC, as a result of Ferro’s acquisition of the former Electro-Science Laboratories (ESL).
This year IMAPS rolls out a new technical program that has been organized to help attendees find their key interests faster. It features 5 leading tracks with topics focused on the major package platforms including wafer level, flip chip, 2D/3D, SiP, as well as the traditional focus areas of reliability, advanced materials, and processes.
We look forward to meeting you at the IMAPS 2018.
VIEW FERRO ELECTRONIC MATERIALS PRODUCTS
ELECTRONIC MATERIALS
