MAY 10-12 Nuremberg, Germany
THANK YOU FOR YOUR INQUIRY. OUR TEAM WILL BE CONTACTING YOU SHORTLY.
We are there!
Trade fairs provide important, economic impulses and set positive signs for the future - therefore we are even happier about our participation as exhibitor at this year's SMTconnect after a forced break of more than 2 years.
Innovative products, future trends and technologies from the areas of development, manufacturing, service and application of microelectronic assemblies and systems - distinguishes SMTconnect as a unique trade fair on the topic of electronics manufacturing in Europe.
Why Ferro Electronic Materials?
Find out and experience high-quality materials and technical products for devices in the electronics industry.
Heater on Steel
Ferro Electronic Materials is known for its premium paste systems for HOS products, required...
CONDUCTOR PASTES FOR CERAMIC COMPONENTS
We offer a broad selection of conductor pastes suitable for many applications in multilayer...
SEALING GLASS PASTES
Ferro Electronics offers Thick–Film sealing glass pastes which find use in end applications...
MATERIALS FOR THICK FILM HYBRID CIRCUITS
Ferro Thick Film Pastes provide the ideal solution for many applications in the telecommunications,...
CERAMIC POWDERS AND FORMULATIONS FOR PASSIVE COMPONENTS
Ferro Electronics supplies a wide range of materials for passive chip component applications...
Ferro´s functional specialties portfolio offers innovative products for customers. Our...
We offer a comprehensive range of engineered electronic materials for precious metal powders and pastes, glass powder and pastes, and ceramic powders for hybrid circuits, microelectronics, advanced packaging, multilayer chip components and other electronic devices.
Based on more than 45 years of experience, Ferro successfully meets the high performance and reliability requirements of the electronics industry.
We will also be presenting steel heating elements for use in electric and hybrid vehicles, high-performance materials for key components in automotive engines, as well as sensors used in engine management systems, exhaust systems and catalytic converters. Electronics packaging materials on display include hybrid integrated circuits (HIC), high temperature co-fired ceramics (HTCC), low temperature co-fired ceramics (LTCC) and more.
Our team is excited to meet you at the booth #5-409.