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CMP SLURRIES FOR RECLAIM WAFERS
Ferro is a leading global manufacturer of optimized high-purity slurries with excellent stability designed for CMP polishing wafers for reclaim processing.
Our CMP slurries achieve optimal metal CMP removal rates and have an excellent shelf life, resulting in decreased cost of ownership and increased productivity using existing equipment and space.
SN8005 RECLAIM WAFER CMP SLURRIES
We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.
- Colloidal silica-based alkaline slurry
- High removal rates (RRs)
- High throughput
- Low defectivity
- Good surface roughness
- Excellent slurry stability and shelf-life
FERRO SN8005 RECLAIM WAFER CMP SLURRIES REACTION MECHANISM
PHYSICAL PROPERTIES for SN8005 SLURRIES
ITEM | POU | SN8005-CIP |
pH | 10.92 | 10.5 |
Solid Content % | 11.02 | 10.58 |
Mean Particle Size (nm) | 0.62 | 0.85 |
Removal Rate (µm/min)1 | 600 ~ 800 | 300 ~ 500 |
Dispersing Ability | Poor | Best |
1With 1:2 dilute for polishing reclaim wafers (32" Speedfamtool) with 2.0 kgf/cm2 down force and 40 rpm/min rotation speed
- Alumina-based alkaline slurry
- Better polishing capability for complex hard films
- High removal rates (RRs)
- High throughput
- Low defectivity
- Good surface roughness
- Excellent slurry stability and shelf-life
VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.
Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.