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CMP SLURRY PRODUCTS FOR SILICON CARBIDE SUBSTRATES

Ferro is a leading global manufacturer of optimized high-purity slurries designed to deliver optimal performance in metal CMP (chemical mechanical planarization) applications.

Wafer Polishing Slurry-Ferro CMP Slurries for Silicon Wafter Polishing
The Ferro product line offers a wide range of aqueous CM slurries for silicon carbide substrates that are developed to achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity utilizing existing equipment and space.
SN12500 – BULK REMOVAL SLURRY FOR SILICON CARBIDE SUBSTRATES
POLISHING PERFORMANCE
Polishing Performance of SN12500 Bulk Removal CMP Slurry for Silicon Wafers and Silicon Carbide Substrates
SN12500 SiC BULK POLISHING SLURRY
  • Abrasive: Al2O3
  • pH : 8 ~ 10
  • 1-kit package (oxidant inside)
  • Recyclable
  • Suba 800 like pad recommended
  • Ra = 0.7 ~ 0.9 Å (AFM)
  • No scratch (Laser Tech.)

SN 12001 – FINE POLISH SLURRY FOR SILICON CARBIDE SUBSTRATES
POLISHING PERFORMANCE
Polishing Performance SN12001 Fine Polishing Slurry for Silicon Wafers and Silicon Carbide Substrates
SN12001 SiC FINE POLISHING SLURRY
  • Abrasive: colloidal silica
  • pH : 8 ~ 10
  • 2-kit package, mix two parts before use
  • Oxidant: add oxidant before use
  • Recyclable
  • Soft polishing pad recommended
  • Ra = 0.6 ~ 0.7Å (AFM)
We also work with our customers to design custom polishing products with tailored properties required for a specific application.
ELECTRONIC MATERIALS VALUE ADDED SERVICES

VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.