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TRUPLANE® 1631 CERIUM OXIDE SLURRIES FOR DIELECTRIC CMP OXIDE REMOVAL

Ferro is a leading global manufacturer of TruePlane® optimized high-purity cerium oxide-based polishing slurries designed to deliver optimal bulk oxide removal in dielectric CMP (chemical mechanical planarization) applications.

Ferro TruPlane 1631 Cerium Oxide Slurry for Dielectric CMP
We offer a wide range of cerium oxide aqueous slurries that achieve optimal dielectric CMP oxide removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space. A tightly controlled particle distribution and LPCs (large particle counts) ensures low-defectivity polishing. 
TruPlane® 1631
TruPlane 1631 is a fast oxide slurry used in applications such as 3D NAND and MEMS where large amounts of oxide removal are required. It is comprised of an engineered ceria particle and a novel accelerant optimized to give high removals with a small Dmean for superior defectivity.

TruPlane 1631 can also be diluted depending upon process requirements.

For high oxide rate polishing that requires a stop layer, we have designed stop-on nitride and stop-on poly additives specifically for use with a fast oxide slurry used in applications including 3D NAND and MEMS where large amounts of oxide removal are required.

Cerium oxide-based dielectric CMP removal products are available as aqueous slurries in packaging ranging from a 2.5-gallon container to a 330-gallon tote.  All products are manufactured to exact application-based requirements providing optimal polishing outcomes with consistent product performance from batch to batch.
CERIUM OXIDE PRODUCTS FOR DIELECTRIC CMP OXIDE REMOVAL RATE COMPARISON
FErro TruPlane 1631 Dielectric CMP Removal Rate vs Commerical Silica Slurry
Ferro’s cerium oxide-based dielectric CMP removal products are available in a diverse range of characteristics allowing the customer to select the product or products best suited for the application needs. 

We also work with our customers to design custom polishing products with tailored properties required for a specific application.
CERIUM OXIDE PRODUCTS FOR DIELECTRIC CMP OXIDE REMOVAL-KEY FEATURES
  • Our slurries deliver industry leading removal rates, decreasing cost of ownership and enabling increased productivity with existing equipment and space
  • Tightly controlled particle distribution and LPCs ensure low defectivity polishing
  • Slurries are compatible with stop on film applications and when combined with Ferro additives are compatible with stop-on nitride and stop-on poly applications

TRUPLANE® 1631 CERIUM OXIDE SLURRIES FOR STI CMP PRODUCT INFORMATION

Ferro TruPlane ®1631 Cerium Oxide Slurries for STI CMP Product Data


ELECTRONIC MATERIALS VALUE ADDED SERVICES

VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.