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TUNGSTEN CMP SLURRIES FOR METAL REMOVAL
Ferro is a leading global manufacturer of optimized high-purity tungsten CMP slurries designed to deliver optimal performance in metal CMP (chemical mechanical planarization) applications.
The SN5000 series is a highly selective tungsten slurry line designed with a stable particle size to reduce any variation in performance. The four times dilution ratio results in a lower cost of ownership.
| ITEMS | SN5000 |
| Tungsten Removal Rate | 4113 Å @ 4 psi |
| TEOS Removal Rate | 79 Å @ 4 psi |
| DIshing @ 15% OP | 455 Å |
| Erosion @ 15% OP | 1082 Å |
| Edge of Erosion @ 15% OP | 1260 Å |
| Shelf Life | 12 months |
| pH Value | 3 |
| Dilution Ratio | 4X (1 : 3) |
| Recommended H2O2 % | 3.10 % |
The SN5100 series is a low or zero selective tungsten buffing slurry. The selectivity is tunable in order to provide the most flexibility for the CMP process.
This formulation does not use a transitional metal catalyst which results in low residual metal ion contamination.
| ITEMS | SN5100 |
| Tungsten Removal Rate | 100~400 Å min @ 1.5 psi |
| TEOS Removal Rate | 100~400 Å min @ 1.5 psi |
| Selectivity | > 1. = 1. or < 1 |
| Abrasive | Colloidal Silica |
| pH Value | 2.5 |
| Shelf Life | 12 months |
| Dilution Ratio | No Dilution |
| Feature of Slurry | Non H2O2 System No transitional metal catalyst |
VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.
Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.
